From 01da00ddd67576ef3ddf56b6fe2994ca6d11d23c Mon Sep 17 00:00:00 2001 From: Vasant Hegde Date: Fri, 13 Oct 2017 10:29:39 +0530 Subject: doc: Update VPD, ECID documentation Recently we added `ecid`, `wafer-id` and `wafer-location` properties under xscom node. Lets document these properties. Also update VPD documentation. Signed-off-by: Vasant Hegde Signed-off-by: Stewart Smith --- doc/xscom-node-bindings.rst | 10 ++++++++++ 1 file changed, 10 insertions(+) (limited to 'doc/xscom-node-bindings.rst') diff --git a/doc/xscom-node-bindings.rst b/doc/xscom-node-bindings.rst index 0fd5e93..ee2c58d 100644 --- a/doc/xscom-node-bindings.rst +++ b/doc/xscom-node-bindings.rst @@ -26,6 +26,16 @@ Each xscom node has the following properties: * reg = * ibm,chip-id = gcid * compatible = "ibm,xscom", "ibm,power8-scom" / "ibm,power7-xscom" + * ecid = + * wafer-id = + * wafer-location = + +ECID +---- +Electronic Chip ID (ECID) is a process by which the wafer number, chip location +(i.e. X,Y) and other optional data items are electrically encoded directly on +the chip. wafer-id property represents wafer number and wafer-location property +represents chip location (both X and Y location). Chiplet endpoints -- cgit v1.1