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| author | Vasant Hegde <hegdevasant@linux.vnet.ibm.com> | 2017-10-13 10:29:39 +0530 |
|---|---|---|
| committer | Stewart Smith <stewart@linux.vnet.ibm.com> | 2017-10-15 20:08:14 -0500 |
| commit | 01da00ddd67576ef3ddf56b6fe2994ca6d11d23c (patch) | |
| tree | b9c9134c3e0777922f9fa0840fa5005778ecd1a4 /doc | |
| parent | 9750eee802f8d6396147ee4e046e1859949a0e55 (diff) | |
| download | skiboot-01da00ddd67576ef3ddf56b6fe2994ca6d11d23c.zip skiboot-01da00ddd67576ef3ddf56b6fe2994ca6d11d23c.tar.gz skiboot-01da00ddd67576ef3ddf56b6fe2994ca6d11d23c.tar.bz2 | |
doc: Update VPD, ECID documentation
Recently we added `ecid`, `wafer-id` and `wafer-location` properties
under xscom node. Lets document these properties. Also update VPD
documentation.
Signed-off-by: Vasant Hegde <hegdevasant@linux.vnet.ibm.com>
Signed-off-by: Stewart Smith <stewart@linux.vnet.ibm.com>
Diffstat (limited to 'doc')
| -rw-r--r-- | doc/device-tree/vpd.rst | 10 | ||||
| -rw-r--r-- | doc/xscom-node-bindings.rst | 10 |
2 files changed, 16 insertions, 4 deletions
diff --git a/doc/device-tree/vpd.rst b/doc/device-tree/vpd.rst index 3e70d38..b54c559 100644 --- a/doc/device-tree/vpd.rst +++ b/doc/device-tree/vpd.rst @@ -2,10 +2,10 @@ VPD (Vital Product Data) ======================== VPD provides the information about the FRUs (Field Replaceable Unit) present in -the system and each vpd node in the device tree represents a FRU. These node and -their properties are specific to the FSP-based systems, passed to the skiboot in -the form of FSP-defined HDAT structures. skiboot parses these structures and -add respective nodes in the device tree. +the system and each vpd node in the device tree represents a FRU. These +properties are passed to skiboot in the form of HDAT structure. Skiboot parses +these structures and adds respective nodes in the device tree. These properties +are available in all system except POWER8 BMC based system. .. code-block:: dts @@ -21,6 +21,8 @@ add respective nodes in the device tree. ibm,chip-id = <0x0>; /* If part is a chip, Processor Id */ size = "0032768"; /* DIMM size (applicable for DIMM VPD only) */ ibm,memory-bus-frequency = <0x0 0x0>; /* DIMM frequency (applicable for DIMM VPD only) */ + vendor = <vendor name> /* Vendor name */ + build-date = <build date> /* Manufacturing build date (applicate for P9 BMC systems only) */ }; }; diff --git a/doc/xscom-node-bindings.rst b/doc/xscom-node-bindings.rst index 0fd5e93..ee2c58d 100644 --- a/doc/xscom-node-bindings.rst +++ b/doc/xscom-node-bindings.rst @@ -26,6 +26,16 @@ Each xscom node has the following properties: * reg = <base-address[#parent-address-cells] size[#parent-size-cells]> * ibm,chip-id = gcid * compatible = "ibm,xscom", "ibm,power8-scom" / "ibm,power7-xscom" + * ecid = <Electronic Chip ID, applicable for POWER9 onwards> + * wafer-id = <wafer ID, applicable for POWER9 onwards> + * wafer-location = <wafer location, applicable for POWER9 onwards> + +ECID +---- +Electronic Chip ID (ECID) is a process by which the wafer number, chip location +(i.e. X,Y) and other optional data items are electrically encoded directly on +the chip. wafer-id property represents wafer number and wafer-location property +represents chip location (both X and Y location). Chiplet endpoints |