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2023-04-05efi_loader: device_path: support blkmap devicesWIP/2023-04-05-blkmap-composable-virtual-block-devicesTobias Waldekranz2-0/+34
Create a distinct EFI device path for each blkmap device. Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-05doc: blkmap: Add introduction and examplesTobias Waldekranz3-0/+113
Explain block maps by going through two common use-cases. Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-05test: blkmap: Add test suiteTobias Waldekranz4-0/+204
Verify that: - Block maps can be created and destroyed - Mappings aren't allowed to overlap - Multiple mappings can be attached and be read/written from/to Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-05cmd: blkmap: Add blkmap commandTobias Waldekranz5-0/+255
Add a frontend for the blkmap subsystem. In addition to the common block device operations, this allows users to create and destroy devices, and map in memory and slices of other block devices. With that we support two primary use-cases: - Being able to "distro boot" from a RAM disk. I.e., from an image where the kernel is stored in /boot of some filesystem supported by U-Boot. - Accessing filesystems not located on exact partition boundaries, e.g. when a filesystem image is wrapped in an FIT image and stored in a disk partition. Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-05blk: blkmap: Add linear device mapping supportTobias Waldekranz2-0/+84
Allow a slice of an existing block device to be mapped to a blkmap. This means that filesystems that are not stored at exact partition boundaries can be accessed by remapping a slice of the existing device to a blkmap device. Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-05blk: blkmap: Add memory mapping supportTobias Waldekranz2-0/+134
Allow a slice of RAM to be mapped to a blkmap. This means that RAM can now be accessed as if it was a block device, meaning that existing filesystem drivers can now be used to access ramdisks. Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-05blk: blkmap: Add basic infrastructureTobias Waldekranz7-0/+405
blkmaps are loosely modeled on Linux's device mapper subsystem. The basic idea is that you can create virtual block devices whose blocks can be backed by a plethora of sources that are user configurable. This change just adds the basic infrastructure for creating and removing blkmap devices. Subsequent changes will extend this to add support for actual mappings. Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-05cmd: blk: Allow generic read/write operations to work in sandboxTobias Waldekranz1-4/+11
Ensure that the memory destination/source addresses of block read/write operations are mapped in before access. Currently, this is only needed on sandbox builds. Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-05image: Fix script execution from FIT images with external dataTobias Waldekranz1-1/+2
Update the script loading code to recognize when script data is stored externally from the FIT metadata (i.e., built with `mkimage -E`). Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-05Merge branch '2023-04-04-android-image-v3-v4-support'Tom Rini11-161/+1009
To quote the author: * This is based on Roman Stratiienko's work to support boot image header version 3 and 4. * This supports the new boot image headers v3, v4 and bootconfig feature. https://source.android.com/docs/core/architecture/bootloader/boot-image-header https://source.android.com/docs/core/architecture/bootloader/implementing-bootconfig - Tested on Amlogic Khadas vim3l, a reference board for Android Open Source Project https://www.khadas.com/vim3l And on AM625 Texas Instruments board with 5.10 linux kernel Main changes : - New partition : vendor boot, with a specific vendor ramdisk - DTB is stored in the vendor boot partition - The generic ramdisk is placed after the vendor ramdisk - Bootconfig feature support Here is a link to see the related android boot flow changes on KHADAS vim3l as an example: https://gitlab.baylibre.com/baylibre/amlogic/atv/u-boot/-/commits/souajih/BootImagev4/
2023-04-04Dockerfile: add mkbootimg toolWIP/2023-04-04-android-image-v3-v4-supportSafae Ouajih1-0/+4
mkbootimg tool is part of the Android project and it is used to pack Android boot images such as boot image and vendor_boot image. Use the following command to run mkbootimg: $ python3 -m mkbootimg Add mkbootimg to the docker file Signed-off-by: Safae Ouajih <souajih@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04test/py: android: extend abootimg testSafae Ouajih1-13/+123
test_abootimg is extended to include the testing of boot images version 4. For this, boot.img and vendor_boot.img have been generated using mkbootimg tool with setting the header version to 4. This tests: - Getting the header version using abootimg - Extracting the load address of the dtb - Extracting the dtb start address in RAM Running test: $ ./test/py/test.py --bd sandbox --build -k test_abootimg Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04doc: android: add documentation for v3, v4 boot image headerSafae Ouajih1-1/+12
Update the Android documentation to describe version 3 and 4 of boot image header. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: support bootconfigSafae Ouajih2-2/+67
Support Bootconfig feature. - The bootconfig feature replaces the androidboot.* kernel cmdline options. This was adapted from downstream [1] commit : 7af0a0506d4d ("cuttlefish: support bootconfig parameters"). Link:[1] https://android.googlesource.com/platform/external/u-boot/ Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: support boot image header version 3 and 4Safae Ouajih6-23/+99
Enable the support for boot image header version 3 and 4 using abootimg command. In order to use version 3 or 4: 1- Vendor boot image address should be given to abootimg cmd. abootimg addr $1 $vendor_boot_load_addr 2- "ramdisk_addr_r" env variable (ramdisk address) should be set to host the ramdisk : generic ramdisk + vendor ramdisk Replace "struct andr_boot_img_hdr_v0*" by "void *" in some functions since v3 and v4 are now supported as well. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04drivers: fastboot: zImage flashing is not supported for v3, v4Safae Ouajih1-0/+8
With vendor boot image introduced in version 3 and 4 of boot image header, boot information is located in both boot image and vendor boot image. Flashing zImage is not supported for version 3 and 4 since this requires updating vendor boot image and/or generating a new image. Print an error message when the boot image header version is greater than 2. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: update android_image_get_dtb_img_addr to support v3, v4Safae Ouajih1-14/+33
Add support for boot image version 3 and 4 in android_image_get_dtb_img_addr(). Since the dtb is now included in vendor_boot image instead of boot image, extract the dtb address from vendor_boot image when a v3 or v4 is used. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: support extra command lineSafae Ouajih1-0/+11
In version 3 and 4 of boot image header, the vendor specific command line are located in vendor boot image. Thus, use extra command line to add those cmd to bootargs. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: ramdisk: support vendor ramdiskSafae Ouajih2-4/+13
Version 3 and 4 of boot image header introduced vendor boot ramdisk: Please check include/android_image.h for details. The ramdisk is now split into a generic ramdisk in boot image and a vendor ramdisk in vendor boot image. Support the new vendor ramdisk. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: update android_image_get_data to support v3, v4Safae Ouajih3-3/+91
Since boot image header version 3 and 4 introduced vendor boot image, use the following functions to fill the generic android structure : andr_image_data: - android_boot_image_v3_v4_parse_hdr() - android_vendor_boot_image_v3_v4_parse_hdr() Update android_image_get_data() to support v3 and v4 Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: add vendor boot image to prepare for v3, v4 supportSafae Ouajih6-39/+81
Introduce vendor boot image for version 3 and 4 of boot image header. The vendor boot image will hold extra information about kernel, dtb and ramdisk. This is done to prepare for boot image version 3 and 4 support. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: boot image header v3, v4 do not support recovery DTBOSafae Ouajih1-2/+2
android_image_get_dtbo() is used to get recovery DTBO via abootimg cmd. This is not supported in boot image header v3 and v4. Thus, print an error message when v1,v2 header version are not used. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: content print is not supported for v3, v4 header versionSafae Ouajih1-1/+5
Content print is not supported for version 3 and 4 of boot image header. Thus, only print that content when v2 is used. Update android_print_contents() to print an error message when trying to print boot image header version 3 or 4 content. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: move to andr_image_data structureSafae Ouajih2-71/+81
Move from andr_boot_img_hdr_v0 to andr_image_data structure to prepare for boot image header version 3 and 4. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: kcomp: support andr_image_dataSafae Ouajih3-1/+113
andr_image_data structure is used as a global representation of boot image header structure. Introduce this new structure to support all boot header versions : v0,v1.v2.v3.v4 and to support v3 and v4 while maitaining support for v0,v1,v2. The need of using andr_image_data comes from the change of header structure in both version 3 and 4. Rework android_image_get_kcomp() to support this new struct. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: add boot image header v3 and v4 structuresSafae Ouajih1-1/+182
Add support for v3/v4 boot image format by adding the following structures: - andr_boot_img_hdr_v3 : describes boot image header - andr_vnd_boot_img_hdr : describes vendor boot image header These definitions have been copied over from the AOSP documentation at [1] and [2] Boot arg sizes are taken from [3]: commit: 35fb6262bc3f (ANDROID: Support for vendor boot) This also adds documentation for boot image header v3/v4 structure that was imported from [4], file: include/bootimg/bootimg.h commit: 8d0922bfb932 (Adding GKI signature in boot.img v4) Link:[1] https://source.android.com/docs/core/architecture/bootloader/boot-image-header Link:[2] https://source.android.com/docs/core/architecture/bootloader/partitions/vendor-boot-partitions#vendor-boot-header Link:[3] https://android.googlesource.com/platform/external/u-boot Link:[4] https://android.googlesource.com/platform/system/tools/mkbootimg Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: replace android_image_check_headerSafae Ouajih5-29/+19
With the new vendor boot image introduced in versions 3 and 4 of boot image header, the header check must be done for both boot image and vendor boot image. Thus, replace android_image_check_header() by is_android_boot_image_header() to only refer to boot image header check. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: support vendor boot image in abootimgSafae Ouajih1-3/+15
Vendor boot image is introduced in boot image header version 3 and 4. Please check [1] for more details. To prepare for boot image v3/v4 support, allow the abootimg command to store the vendor_boot image address. Full support for this new format will be done in a future patch. Link:[1] https://source.android.com/docs/core/architecture/bootloader/partitions/vendor-boot-partitions Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04android: boot: rename andr_img_hdr -> andr_boot_img_hdr_v0Safae Ouajih6-33/+129
Android introduced boot header version 3 or 4. The header structure change with version 3 and 4 to support the new updates such as: - Introducing Vendor boot image: with a vendor ramdisk - Bootconfig feature (v4) Change andr_img_hdr struct name to maintain support for version v0, v1 and v2 while introducing version 3 and 4. Signed-off-by: Safae Ouajih <souajih@baylibre.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com> Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2023-04-04Merge branch '2023-04-04-update-to-clang-16'Tom Rini6-15/+35
- Update our CI to use clang-16 for tests. This also changes slightly how we do linker lists so that we don't rely on undefined behavior that lead to clang-15 and later failing to work (and in some cases seemingly, earlier versions of clang would sometimes fail).
2023-04-04CI: Move to clang-16WIP/2023-04-04-update-to-clang-16Tom Rini3-7/+7
As this is now the stable release, move to using that now for our tests. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-04linker_lists: Rework start/end macros to not rely on undefined behaviorTom Rini1-4/+12
Per the GCC bug listed below, the way we do linker lists is relying on undefined behavior that seems to work in gcc, but doesn't always work in clang. Andrew suggests rewriting our start/end macros in a different way (as implemented here, from what he said in comment 1) to avoid these problems. Reported-by: AdityaK <appujee@google.com> Suggested-by: Andrew Pinski <apinski@marvell.com> Link: https://gcc.gnu.org/bugzilla/show_bug.cgi?id=108915 Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Andrew Pinski <apinski@marvell.com>
2023-04-04smartweb: Enable LTOTom Rini1-0/+1
In order to prepare for slight size growth due to reworking linker list support, enable LTO here to save more space again. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Heiko Schocher <hs@denx.de>
2023-04-04Dockerfile: Populate a pip cacheTom Rini1-0/+11
Given the number of jobs in CI we have which use python and pip install packages, we should do this once in the Dockerfile, in order to populate the cache. We let each job continue to create and use the virtual environments they need to facilitate making updates to these environments easier. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-04pytest: Update requirements to match sphinx versionsTom Rini1-4/+4
In order to better make use of pip caches, and also for better overall consistency, we should use the same versions of packages in each of our python requirements files. Update pytest to use the newer versions of packages we use in sphinx builds. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-04-04Merge tag 'u-boot-imx-next-20230404' of ↵WIP/04Apr2023Tom Rini44-355/+7264
https://gitlab.denx.de/u-boot/custodians/u-boot-imx u-boot-imx-next-20230404 ------------------------ CI : https://source.denx.de/u-boot/custodians/u-boot-imx/-/pipelines/15887 - boards : DH-Electronics, Toradex, imx8mp-beacon-kit
2023-04-04arm64: imx: Add support for imx8mp-beacon-kitAdam Ford18-0/+3578
Beacon Embedded has an i.MX8M Plus development kit which consists of a SOM + baseboard. The SOM includes Bluetooth, WiFi, QSPI, eMMC, and one Ethernet PHY. The baseboard includes audio, HDMI, USB-C Dual Role port, USB Hub with five ports, a PCIe slot, and a second Ethernet PHY. The device trees are already queued for inclusion in Linux 6.3. Signed-off-by: Adam Ford <aford173@gmail.com> Reviewed-by: Tom Rini <trini@konsulko.com>
2023-04-04ARM: imx: Enable LTO for DH electronics i.MX6 DHCOMMarek Vasut1-0/+1
Enable LTO to reduce the size of SPL, which with SPL SDP support may be close to the limit. Signed-off-by: Marek Vasut <marex@denx.de>
2023-04-04ARM: dts: imx: Add support for Data Modul i.MX8M Plus eDM SBCMarek Vasut14-0/+3519
Add support for Data Modul i.MX8M Plus eDM SBC board. This is an evaluation board for various custom display units. Currently supported are serial console, ethernet, eMMC, SD, SPI NOR, USB. Signed-off-by: Marek Vasut <marex@denx.de>
2023-04-04ARM: dts: imx: Add WDT reboot bindings on DH i.MX6 DHSOMMarek Vasut1-0/+10
Add WDT reboot bindings on DH i.MX6 DHSOM to permit the platform to reboot via WDT in U-Boot. These are custom U-Boot bindings, hence they are placed in -u-boot.dtsi . Reviewed-by: Fabio Estevam <festevam@denx.de> Signed-off-by: Marek Vasut <marex@denx.de>
2023-04-04board: verdin-imx8mp: change prints in spl_dram_init functionEmanuele Ghidoli1-4/+10
change prints to show which DDR configuration (single/dual rank) is used Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com> Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
2023-04-04board: verdin-imx8mp: compact slight different lpddr4 configurationEmanuele Ghidoli3-322/+75
Deduplicate similar DDRC configurations and LPDDR4 training patterns by patching a single configuration. The aim is to reduce the SPL memory footprint and simplify maintenance of lpddr4_timing.c Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com> Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
2023-04-04board: verdin-imx8mp: update lpddr4 configuration and trainingEmanuele Ghidoli1-24/+25
Update LPDDR4 configuration and training using updated spreadsheet and tools from NXP using data from previous spreadsheet and verified toward datasheet: - MX8M_Plus_LPDDR4_RPA_v9.xlsx - mscale_ddr_tool_v3.30.exe From: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX-8M-Family-DDR-Tool-Release/ta-p/1104467 Some register values differ due to these fixes/modifications: - corrected calculation of T_CKPDX parameter (equal to tCKCKEH for LPDDR4) - corrected ECC related items, none of which affect normal operation when ECC is not enabled - corrected formula for calculation of tRTP in cell D122 Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com> Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
2023-04-04board: verdin-imx8mp: fix lpddr4 refresh timingEmanuele Ghidoli1-12/+12
Change tRFCmin (tRFCab) from 280 ns to 380 ns to be compliant with current and futures memories. Fixes: 2bc2f817cea7 ("board: toradex: add verdin imx8m plus support") Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com> Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
2023-04-04board: verdin-imx8mp: update ddrc config for different lpddr4 memoriesEmanuele Ghidoli2-5/+4
Add support to Verdin IMX8MP V1.1B SKU which uses MT53E1G32D2FW-046 WT:B memory. Compared to the 8 GB memory (MT53E2G32D4NQ-046 WT:A) used on Verdin IMX8MP V1.0A it has 16 row addresses instead of 17. In fact, the new memory, is a 2 GB/rank memory. The 8 GB memory is a 4 GB/rank memory. Manually tweaking Host Interface addresses vs LPDDR4 signals mapping it is possible to have a single configuration working with both memories: - Old configuration: HIF bit 30 -> rank, HIF bit 29 -> Row 16 - New configuration: HIF bit 29 -> rank, HIF bit 30 -> Row 16 With this change the memory space from the host processor is contiguous for both the configurations and the correct memory size is computed using get_ram_size() at runtime. Support for single rank memories still works thanks to the fact dual ranks training fails (ddr_init->ddr_cfg_phy) toward single rank memories. Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com> Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
2023-04-04configs: tqma6: enable DM_THERMALMarkus Niebel6-0/+12
Enabling this gives some informal output at boot time. Signed-off-by: Markus Niebel <Markus.Niebel@ew.tq-group.com>
2023-04-04configs: tqma6: enable DM for MDIO / PHYMarkus Niebel6-0/+18
Since this works with current device trees, enabled these. Signed-off-by: Markus Niebel <Markus.Niebel@ew.tq-group.com>
2023-04-04configs: tqma6: switch to DM_SERIALMarkus Niebel6-6/+6
Usage without DM_SERIAL is deprecated. Fix this. Signed-off-by: Markus Niebel <Markus.Niebel@ew.tq-group.com>
2023-04-04arm: imx: add u-boot-nand.imx to boot from NAND without SPLLuca Ceresoli2-0/+9
U-Boot can be booted from NAND without SPL by prepending the DCD header to the actual U-Boot binary. However this requires prepending 1024 bytes to u-boot.imx (DCD + u-boot.bin). There is already a similar target to build spl/u-boot-nand-spl.imx, add the same option for no-SPL boot. Tested on i.MX6ULL. The resulting layout of u-boot-nand.imx is: - Offset 0x0000 (0 KiB): padding - Offset 0x0400 (1 KiB): DCD header - Offset 0x1000 (4 KiB): u-boot.bin Signed-off-by: Luca Ceresoli <luca.ceresoli@bootlin.com>
2023-04-04ARM: imx: Enable SDP download in SPL on DH i.MX6 DHSOMMarek Vasut2-2/+5
Enable SDP protocol support in SPL for DH i.MX6 DHSOM, now that those components fit into the SPL due to LTO. To start U-Boot via SDP upload on i.MX6 DHSOM based board, proceed as follows: - Compile imx_usb [1] . - Power off the i.MX6 DHSOM based board. - Connect both USB-serial console and USB-OTG miniB ports to host PC. - Switch board to USB boot mode. - Power on the board. - Verify using '$ dmesg' that a new device has been detected as follows: New USB device found, idVendor=15a2, idProduct=0054, bcdDevice= 0.01 New USB device strings: Mfr=1, Product=2, SerialNumber=0 Product: SE Blank ARIK Manufacturer: Freescale SemiConductor Inc - Upload U-Boot SPL: $ imx_usb u-boot-with-spl.imx - Wait for SPL to come up, the following print ought to be the last on UART console: SDP: handle requests... - Upload U-Boot proper: $ imx_usb u-boot.img [1] https://github.com/boundarydevices/imx_usb_loader.git Signed-off-by: Marek Vasut <marex@denx.de>
generated by cgit v1.1 at 2024-07-10 21:32:29 +0000